Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Elsaid Hassan Hammad
Journal: Materials and Design elsevier Volume:
Keywords : Design , lead-free candidate alloys , low-temperature soldering applications    
Abstract:
The coupling effect of both minor alloying addition and reducing the amount of Zn phase have been proposed as an important strategy to improve the integrity and reliability of eutectic Sn–9Zn solder joints. In this work, the changes in mi
    
     
 
       

Author Related Publications

  • Ahmed Elsaid Hassan Hammad, "Nano-Lead free solder alloys for electronic packaging and integration", Pushpa Publishing House, 2016 More
  • Ahmed Elsaid Hassan Hammad, "Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni", Elsevier, 2013 More
  • Ahmed Elsaid Hassan Hammad, "Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications", Elsevier, 2013 More
  • Ahmed Elsaid Hassan Hammad, "Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions", elsevier, 2012 More
  • Ahmed Elsaid Hassan Hammad, "Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05", springer, 2014 More

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