Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05

Faculty Science Year: 2014
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Elsaid Hassan Hammad
Journal: Journal of ELECTRONIC MATERIALS springer Volume:
Keywords : Mechanical Deformation Behavior , Sn-Ag-Cu Solders with Minor    
Abstract:
The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni e
    
     
 
       

Author Related Publications

  • Ahmed Elsaid Hassan Hammad, "Nano-Lead free solder alloys for electronic packaging and integration", Pushpa Publishing House, 2016 More
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  • Ahmed Elsaid Hassan Hammad, "Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications", Elsevier, 2013 More
  • Ahmed Elsaid Hassan Hammad, "Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions", elsevier, 2012 More
  • Ahmed Elsaid Hassan Hammad, "Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy", elsevier, 2013 More

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