Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

Faculty Science Year: 2012
Type of Publication: ZU Hosted Pages:
Authors:
Abdulrahman Abdullah Awadallah
Journal: Materials & Design Elsevier Volume:
Keywords : Microstructure, mechanical properties, , deformation behavior of Sn–1.0Ag–0.5Cu    
Abstract:
Minor alloying addition to solders has been an important strategy to improve the integrity and reliability of Pb-free solders joint. In this study, the effects of 0.06Ni and 0.5Sb additives on the microstructure and solidification behavio
    
     
 
       

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