Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications

Faculty Science Year: 2101
Type of Publication: ZU Hosted Pages:
Authors:
Journal: Journal of Materials Science: Materials in Electronics springer Volume:
Keywords : Change aspects , microstructure , mechanical behavior , Bi and    
Abstract:
Sn–Cu alloys were recommended as a promising substitute for traditional Sn–Pb alloy in wave soldering applications. In the present study, the change of microstructure, thermal and mechanical behavior associated with alloying of Bi and Z
   
     
 
       

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