Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications

Faculty Science Year: 2019
Type of Publication: ZU Hosted Pages: 321:263
Authors:
Abdulrahman Abdullah Awadallah
Journal: Journal of Materials Science: Materials in Electronics Springer Volume:
Keywords : Leveraging prior strain rates effect during    
Abstract:
Prior strain rate history during stress relaxation (SR) behavior is one of the fundamental issues adapting the design of solder  joints. In this paper, the SR tests were performed on Sn–1.7Ag–0.7Cu (SAC177) solder with Te and Co addition at the elastic  region. The SR of SAC177 solders occurred at high prior deformation history could induce unexpected relaxation resistance
    
     
 
       

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