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Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications
Faculty
Science
Year:
2019
Type of Publication:
ZU Hosted
Pages:
321:263
Authors:
Abdulrahman Abdullah Awadallah
Staff Zu Site
Abstract In Staff Site
Journal:
Journal of Materials Science: Materials in Electronics Springer
Volume:
Keywords :
Leveraging prior strain rates effect during
Abstract:
Prior strain rate history during stress relaxation (SR) behavior is one of the fundamental issues adapting the design of solder joints. In this paper, the SR tests were performed on Sn–1.7Ag–0.7Cu (SAC177) solder with Te and Co addition at the elastic region. The SR of SAC177 solders occurred at high prior deformation history could induce unexpected relaxation resistance
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