Microstructural modifications and properties of low-Ag-content SneAgeCu solder joints induced by Zn alloying

Faculty Science Year: 2015
Type of Publication: ZU Hosted Pages:
Authors:
Haitham Husseini Ali Mohamed Fathy
Journal: Optik Elsevier Volume:
Keywords : Microstructural modifications , properties , low-Ag-content SneAgeCu solder joints    
Abstract:
The effects of Zn addition on microstructure development and tensile properties of Sne2.0Age0.7Cu (SAC207) lead-free solders were investigated. Microstructural analysis reveal that 1.5 wt.% Zn addition not only refined the Ag3Sn and Cu6Sn
    
     
 
       

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