Nano-Lead free solder alloys for electronic packaging and integration

Faculty Science Year: 2016
Type of Publication: ZU Hosted Pages:
Authors:
Journal: International Journal of Materials Engineering and Technology Pushpa Publishing House Volume:
Keywords : Nano-Lead free solder alloys , electronic packaging    
Abstract:
Abstract Synthesis of metal nanoparticles with specific properties is a newly established research area attracting a great deal of attention. Several methods have been put forward for synthesis of these materials, namely chemical vapor
   
     
 
       

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