Nano-Lead free solder alloys for electronic packaging and integration

Faculty Science Year: 2016
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Elsaid Hassan Hammad
Journal: International Journal of Materials Engineering and Technology Pushpa Publishing House Volume:
Keywords : Nano-Lead free solder alloys , electronic packaging    
Abstract:
Abstract Synthesis of metal nanoparticles with specific properties is a newly established research area attracting a great deal of attention. Several methods have been put forward for synthesis of these materials, namely chemical vapor
   
     
 
       

Author Related Publications

  • Ahmed Elsaid Hassan Hammad, "Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni", Elsevier, 2013 More
  • Ahmed Elsaid Hassan Hammad, "Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications", Elsevier, 2013 More
  • Ahmed Elsaid Hassan Hammad, "Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions", elsevier, 2012 More
  • Ahmed Elsaid Hassan Hammad, "Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05", springer, 2014 More
  • Ahmed Elsaid Hassan Hammad, "Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy", elsevier, 2013 More

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  • Abdulrahman Abdullah Awadallah, "Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions", Elsevier, 2012 More
  • Mona Hussein Ibrahim Mahmud, "Biophysical and Biological Studies on the Effect of Electromagnetic Field on the Ehrlich Tumor Cells Implanted In Mice", MARS-LAND PRESS, 2013 More
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