Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Abdulrahman Abdullah Awadallah
Journal: Materials & Design Elsevier Volume:
Keywords : Improved strength , , , Zn-doped Sn–2.0Ag–0.5Cu lead-free solder    
Abstract:
The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder for flip-chip interconnects. The changes in microstructure, microhardness and mechanical properties
   
     
 
       

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