Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Abdulrahman Abdullah Awadallah
Journal: Materials & Design Elsevier Volume:
Keywords : Improved strength , , , Zn-doped Sn–2.0Ag–0.5Cu lead-free solder    
Abstract:
The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder for flip-chip interconnects. The changes in microstructure, microhardness and mechanical properties
   
     
 
       

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  • Abdulrahman Abdullah Awadallah, "Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions", Elsevier, 2013 More
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  • Abdulrahman Abdullah Awadallah, "Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles", springer, 2013 More

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