Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Abdulrahman Abdullah Awadallah
Journal: J Mater Sci: Mater Electron springer Volume:
Keywords : Thermal analysis , mechanical properties , Sn–1.0Ag–0.5Cu solder alloy    
Abstract:
The size and morphology of intermetallic compounds (IMCs) of Sn–1.0Ag–0.5Cu (SAC105) solder alloys can have a significant influence on the mechanical strength of solder joints. The aim of the present study is to investigate the influenc
    
     
 
       

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