Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Journal: Materials and Design Elsevier Volume:
Keywords : Evolution , microstructure, thermal , creep properties , Ni-doped Sn–0.5Ag–0.7Cu    
Abstract:
For development of lead-free solder for advance electrical components, the correlation of microstructure with thermal and creep properties of novel Ni-doped Sn–0.5Ag–0.7Cu (SAC (0507)) lead free solders has been investigated. Results show
   
     
 
       

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