Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Elsaid Hassan Hammad
Journal: Materials and Design Elsevier Volume:
Keywords : Evolution , microstructure, thermal , creep properties , Ni-doped Sn–0.5Ag–0.7Cu    
Abstract:
For development of lead-free solder for advance electrical components, the correlation of microstructure with thermal and creep properties of novel Ni-doped Sn–0.5Ag–0.7Cu (SAC (0507)) lead free solders has been investigated. Results show
    
     
 
       

Author Related Publications

  • Ahmed Elsaid Hassan Hammad, "Nano-Lead free solder alloys for electronic packaging and integration", Pushpa Publishing House, 2016 More
  • Ahmed Elsaid Hassan Hammad, "Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni", Elsevier, 2013 More
  • Ahmed Elsaid Hassan Hammad, "Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions", elsevier, 2012 More
  • Ahmed Elsaid Hassan Hammad, "Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05", springer, 2014 More
  • Ahmed Elsaid Hassan Hammad, "Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy", elsevier, 2013 More

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