Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Abdulrahman Abdullah Awadallah
Journal: Materials and Design ُElsevier Volume:
Keywords : Evolution , thermal property , creep resistance , , , Zn-doped Sn–2.0Ag–0.5Cu    
Abstract:
The effect of small amount of Ni and Zn additions on thermal behavior and creep properties of Sn–2Ag– 0.5Cu (SAC 205) lead free solder alloy was investigated. Additions of Ni and Zn, respectively, into SAC (205) solder caused its undercoo
    
     
 
       

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