Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Journal: Materials and Design ُElsevier Volume:
Keywords : Evolution , thermal property , creep resistance , , , Zn-doped Sn–2.0Ag–0.5Cu    
ي هذه الورقة ، ونحن التقرير إجراء مريحة ومفيدة لتحسين سلامة و موثوقية سهل الانصهار القصدير، 9Zn لحام باستخدام الاضافات الطفيفة صناعة السبائك ني و بينالي الشارقة بعد تقليل كمية من المرحلة الزنك . وتشير النتائج إلى أن صناعة السبائك ني أو بينا

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