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Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders
Faculty
Science
Year:
2013
Type of Publication:
ZU Hosted
Pages:
Authors:
Abdulrahman Abdullah Awadallah
Staff Zu Site
Abstract In Staff Site
Journal:
Materials and Design ُElsevier
Volume:
Keywords :
Evolution , thermal property , creep resistance , , , Zn-doped Sn–2.0Ag–0.5Cu
Abstract:
The effect of small amount of Ni and Zn additions on thermal behavior and creep properties of Sn–2Ag– 0.5Cu (SAC 205) lead free solder alloy was investigated. Additions of Ni and Zn, respectively, into SAC (205) solder caused its undercoo
Author Related Publications
Abdulrahman Abdullah Awadallah, "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications", springer, 2101
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Abdulrahman Abdullah Awadallah, "Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions", Elsevier, 2013
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Abdulrahman Abdullah Awadallah, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Elsevier, 2013
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Abdulrahman Abdullah Awadallah, "Fabrication ofsiliconcarbidereinforcedaluminummatrixnanocomposites and characterizationofitsmechanicalpropertiesusing non-destructivetechnique", Elsevier, 2012
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Abdulrahman Abdullah Awadallah, "Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles", springer, 2013
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Nabil Mohamed Mohamed Hasana, "EVALUATION OF RADIONUCLIDE CONCENTRATIONS AND ASSOCIATED RADIOLOGICAL HAZARD INDEXES IN BUILDING MATERIALS USED IN EGYPT", Downloaded from http://rpd.oxfordjournals.org/ by guest on July 21, 2013, 2013
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Essam Mohamed AbdelFattah Ibrahim, "Investigation of capacitively coupled argon plasma driven at various frequencies and validation of surface waves excitation", Elsevier, 2013
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Ahmed Elfalaky Elsaid Abdelrehim, "AC conductivity and dielectric properties of In2S3 lms", England, 2001
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