Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Abdulrahman Abdullah Awadallah
Journal: Materials and Design ُElsevier Volume:
Keywords : Evolution , thermal property , creep resistance , , , Zn-doped Sn–2.0Ag–0.5Cu    
Abstract:
ي هذه الورقة ، ونحن التقرير إجراء مريحة ومفيدة لتحسين سلامة و موثوقية سهل الانصهار القصدير، 9Zn لحام باستخدام الاضافات الطفيفة صناعة السبائك ني و بينالي الشارقة بعد تقليل كمية من المرحلة الزنك . وتشير النتائج إلى أن صناعة السبائك ني أو بينا
    
     
 
       

Author Related Publications

  • Abdulrahman Abdullah Awadallah, "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications", springer, 2101 More
  • Abdulrahman Abdullah Awadallah, "Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions", Elsevier, 2013 More
  • Abdulrahman Abdullah Awadallah, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Elsevier, 2013 More
  • Abdulrahman Abdullah Awadallah, "Fabrication ofsiliconcarbidereinforcedaluminummatrixnanocomposites and characterizationofitsmechanicalpropertiesusing non-destructivetechnique", Elsevier, 2012 More
  • Abdulrahman Abdullah Awadallah, "Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles", springer, 2013 More

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