A key factor in ensuring the service life of microelectronic devices is the creep and thermal characteristics of alloys. As a result, the present work aims to develop the creep features and thermal analysis of Sn-2.0 wt% Ag- 0.5 wt% Cu-2.0 wt% Zn (SAC205-2Zn) in the presence of a magnetic field. Based on the microstructure examination, applying the magnetic field reduced the β–Sn fraction and refined the eutectic phases. The average grain size of β–Sn in the SAC205-2Zn alloy was 27–35 ± 3 μm, and the average size of intermetallic compounds (IMCs) was 4–9 ± 1 μm. In contrast, the average sizes of IMCs and β-Sn in Sn-2.0 wt% Ag-0.5 wt% Cu-2.0 wt% Zn with a magnetic field (SAC205-2Zn-B) were 1–5 ± 1 and 10–16 ± 2 μm, respectively. According to the DSC analysis, the melting temperatures (Tm) were 221.7 ◦C for SAC205-2Zn and 221.8 ◦C for SAC205-2Zn-B. In addition, the pasty ranges for SAC205-2Zn and SAC205-2Zn-B were 8.6 and 8.2 ◦C, respectively. Besides, the magnetic field’s existence reduced the undercooling (ΔT) of SAC205-2Zn by 15.5 ◦C, leading to an improvement in the solidified phases’ nucleation. Clearly, SAC205-2Zn-B displayed a lower creep rate (38.5 %) and higher creep resistance compared with those of the SAC205-2Zn alloy. Interestingly, the creep lifetime increased by 164 % under the magnetic field effects. The obtained results using a novel feasible method have significant implications for electronic applications.