Development of Sn-1.0Ag-0.7Cu composite solder with improved resistivity and strength–ductility synergy through additions of Ni, Te and MWCNT

Faculty Science Year: 2021
Type of Publication: ZU Hosted Pages:
Authors:
Abdulrahman Abdullah Awadallah
Journal: J Mater Sci: Mater Electron Springer Volume:
Keywords : Development , Sn-1.0Ag-0.7Cu composite solder with improved resistivity    
Abstract:
Development of Sn-1.0Ag-0.7Cu composite solder with improved resistivity and strength–ductility synergy through additions of Ni, Te and MWCNT
    
     
 
       

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  • Abdulrahman Abdullah Awadallah, "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications", springer, 2101 More
  • Abdulrahman Abdullah Awadallah, "Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders", ُElsevier, 2013 More
  • Abdulrahman Abdullah Awadallah, "Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions", Elsevier, 2013 More
  • Abdulrahman Abdullah Awadallah, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Elsevier, 2013 More
  • Abdulrahman Abdullah Awadallah, "Fabrication ofsiliconcarbidereinforcedaluminummatrixnanocomposites and characterizationofitsmechanicalpropertiesusing non-destructivetechnique", Elsevier, 2012 More

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  • Hesham Mohamed Zaki Mostafa, "Magnesium-Zinc Ferrite Nanoparticles: Effect of Copper Doping on the Structural, Electrical and Magnetic Properties,", American Scientific Publishers, 2013 More
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