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Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field
Faculty
Science
Year:
2020
Type of Publication:
ZU Hosted
Pages:
113932
Authors:
Ahmed Elsaid Hassan Hammad
Staff Zu Site
Abstract In Staff Site
Journal:
Microelectronics Reliability ُElsevier
Volume:
Keywords :
Achieving microstructure refinement , superior mechanical performance of
Abstract:
The investigation of a prospective lead-free solder alloy provides the essential data for microelectronic applications and estimation of solder joint reliability. In this study, we used the rotary magnetic field (RMF) as a novel approach to improve the mechanical performance and microstructure of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) lead-free solder alloy. The results revealed that both microstructure evolution and tensile characteristics enhanced by applying RMF. Microstructure studies showed that applying RMF reduced the grain size of β-Sn and IMCs. These modifications improved the tensile strength of the solder alloy. RMF improved Ultimate tensile strength (UTS), Yield stress (YS), Young modulus (E), and Elongation (El.%) of SACZ at room temperature by ~110%, 112%, 119%, and 108%, respectively. Besides, stress exponent, n, over the entire temperature and activation energy, Q, parameters calculated using the Garofalo hyperbolic sine law. n values were 5.9–8.3for SACZ alloy and 6.8–9.6 for SACZ-B alloy. Q values were ~ 51.8 kJ/mol for SACZ alloy and 79.2 kJ/mol for SACZ-B alloy close to pipe diffusion-controlled creep of tin. According to results, RMF is a promising approach to develop the microstructure evolution and mechanical characteristics of alloys. We hoped that the results would be useful for microelectronic applications.
Author Related Publications
Ahmed Elsaid Hassan Hammad, "Nano-Lead free solder alloys for electronic packaging and integration", Pushpa Publishing House, 2016
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Ahmed Elsaid Hassan Hammad, "Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni", Elsevier, 2013
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Ahmed Elsaid Hassan Hammad, "Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications", Elsevier, 2013
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Ahmed Elsaid Hassan Hammad, "Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions", elsevier, 2012
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Ahmed Elsaid Hassan Hammad, "Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05", springer, 2014
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Department Related Publications
Abdullah Fathi Aly Saad, "Ageing effects on polymeric track detectors: studies of etched tracks at nanosize scale using atomic force microscope", RADIATION PHYSICS, 2012
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Ahmed Elfalaky Elsaid Abdelrehim, "Electrical and Dielectric Properties of Charge Transfer Complexes: Interactions between Norfloxacin and Ciprofloxacin with Picric Acid and 3,5-Dinitrobenzoic Acid1", Russa, 2013
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Ahmed Elfalaky Elsaid Abdelrehim, "Spectroscopic and physical measurements on charge-transfer complexes: Interactions between norfloxacin and ciprofloxacin drugs with picric acid and 3,5-dinitrobenzoic acid acceptors", Englabd, 2011
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Ahmed Elfalaky Elsaid Abdelrehim, "Bone-like Material, Synthesis, Optimization and Characterization", America, 2014
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Ahmed Elfalaky Elsaid Abdelrehim, "Structural and electrical properties of HgTe thin films", england, 2000
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