The effect of the geometric and thermal parameters on the thermal stresses during the passive cooling of printed circuit boards

Faculty Engineering Year: 2019
Type of Publication: ZU Hosted Pages:
Authors:
Mohammed Abdelhamied Ahmed Boraee
Journal: 2019 Novel Intelligent and Leading Emerging Sciences Conference (NILES) IEEE Volume:
Keywords : , effect , , geometric , thermal parameters , , thermal stresses    
Abstract:
The effect of components’ thermal properties in addition to their geometric configuration on the developed thermal stress in a model printed circuit board (PCB) is investigated. This effect is quantified through three parameters, the average normalized temperature gradient, maximum normalized temperature gradient and the uniformity factor. It is found that the effect of the geometric configuration, especially that of the heat-generating component, is more significant than the thermal properties of the components.
    
     
 
       

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