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The effect of the geometric and thermal parameters on the thermal stresses during the passive cooling of printed circuit boards
Faculty
Engineering
Year:
2019
Type of Publication:
ZU Hosted
Pages:
Authors:
Mohammed Abdelhamied Ahmed Boraee
Staff Zu Site
Abstract In Staff Site
Journal:
2019 Novel Intelligent and Leading Emerging Sciences Conference (NILES) IEEE
Volume:
Keywords :
, effect , , geometric , thermal parameters , , thermal stresses
Abstract:
The effect of components’ thermal properties in addition to their geometric configuration on the developed thermal stress in a model printed circuit board (PCB) is investigated. This effect is quantified through three parameters, the average normalized temperature gradient, maximum normalized temperature gradient and the uniformity factor. It is found that the effect of the geometric configuration, especially that of the heat-generating component, is more significant than the thermal properties of the components.
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Mohammed Abdelhamied Ahmed Boraee, "A Hydro-Kinematic approach for the design of compact corrugated plate interceptors for the de-oiling of produced water", Elsevier, 2018
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Mohammed Abdelhamied Ahmed Boraee, "Thermal optimization of square pin-fins in crossflow using the Lattice Boltzmann Method with quadratic thermal equilibrium", Elsevier B.V., 2019
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Sayed Ahmed ELsayed Sayed, "Finite ellment analysis of the effect of hydrodynamic lubricants on friction contact properties of adjacent bodies", لايوجد, 1900
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Sayed Ahmed ELsayed Sayed, "The interference effect of a wall on the flow around two circular cylinders arranged in tandem", لايوجد, 1900
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