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The role of delayed elasticity and stress relaxation in Sn-Bi-Cu leadfree solders solidified under permanent magnet stirring
Faculty
Science
Year:
2017
Type of Publication:
ZU Hosted
Pages:
Authors:
Abdulrahman Abdullah Awadallah
Staff Zu Site
Abstract In Staff Site
Journal:
Journal of Alloys and Compounds Journal of Alloys and Compounds
Volume:
Keywords :
, role , delayed elasticity , stress relaxation , Sn-Bi-Cu
Abstract:
This paper develops methods to explore the influence of permanent magnet stirring (PMS) on solidification microstructure, thermal behavior and creep parameters of Sn-20Bi-0.4Cu alloys predicted from the primary creep stage at 25 C. A ser
Author Related Publications
Abdulrahman Abdullah Awadallah, "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications", springer, 2101
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Abdulrahman Abdullah Awadallah, "Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders", ُElsevier, 2013
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Abdulrahman Abdullah Awadallah, "Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions", Elsevier, 2013
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Abdulrahman Abdullah Awadallah, "Fabrication ofsiliconcarbidereinforcedaluminummatrixnanocomposites and characterizationofitsmechanicalpropertiesusing non-destructivetechnique", Elsevier, 2012
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Department Related Publications
Ahmed Mohamed Eltaher Abdulaal, "Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products", Materials and Design, 2014
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Rania Mohamed Ahmed Khalil, "A shape tailored gold-conductive polymer nanocomposite as a transparent electrode with extraordinary insensitivity to volatile organic compounds (VOCs)", Article (PDF Available) in Scientific Reports 6(33895):1-10 · September 2016 with 81 Reads, 2016
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