Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles

Faculty Science Year: 2017
Type of Publication: ZU Hosted Pages:
Authors:
Journal: Microelectronics Reliability Elsevier Volume:
Keywords : Enhancing , microstructure , tensile creep resistance of Sn-3.0Ag-0.5Cu    
Abstract:
Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles
   
     
 
       

Author Related Publications

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  • Azza Azab Ibrahim Ibrahim, "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications", springer, 2101 More
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Department Related Publications

  • Abdulrahman Abdullah Awadallah, "Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions", Elsevier, 2013 More
  • Abdulrahman Abdullah Awadallah, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Elsevier, 2013 More
  • Abdulrahman Abdullah Awadallah, "Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles", springer, 2013 More
  • Salwa Fahim Ibrahim Mansour, "ANTIFUNGAL ACTIVITY OF ZINC OXIDE NANOPARTICLES AGAINST DERMATOPHYTIC LESIONS OF CATTLE", كلية العلوم, 2013 More
  • Salwa Fahim Ibrahim Mansour, "A Mossbauer and x- ray diffraction investigation of Li- Ti ferrites", J . Phys.:Condens. Matter, 1994 More
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