Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles

Faculty Science Year: 2017
Type of Publication: ZU Hosted Pages:
Authors:
Azza Azab Ibrahim Ibrahim
Journal: Microelectronics Reliability Elsevier Volume:
Keywords : Enhancing , microstructure , tensile creep resistance of Sn-3.0Ag-0.5Cu    
Abstract:
Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles
    
     
 
       

Author Related Publications

  • Azza Azab Ibrahim Ibrahim, "Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions", Materials and Design, 2013 More
  • Azza Azab Ibrahim Ibrahim, "Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy", Materials and Design, 2014 More
  • Azza Azab Ibrahim Ibrahim, "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications", springer, 2101 More
  • Azza Azab Ibrahim Ibrahim, "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications", USA, 2017 More
  • Azza Azab Ibrahim Ibrahim, "The role of delayed elasticity and stress relaxation in Sn-Bi-Cu leadfree solders solidified under permanent magnet stirring", Journal of Alloys and Compounds, 2017 More

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