Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles

Faculty Science Year: 2017
Type of Publication: ZU Hosted Pages:
Authors:
Journal: Microelectronics Reliability Elsevier Volume:
Keywords : Enhancing , microstructure , tensile creep resistance of Sn-3.0Ag-0.5Cu    
Abstract:
Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles
   
     
 
       

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