Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications

Faculty Science Year: 2017
Type of Publication: ZU Hosted Pages:
Authors:
Journal: J Mater Sci: Mater Electron USA Volume:
Keywords : Change aspects , microstructure , mechanical behavior , Bi and    
Abstract:
التغيرات فى الخواص التركيبية والميكانيكية لمركب Bi
   
     
 
       

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