Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for lip chip technology

Faculty Science Year: 2017
Type of Publication: ZU Hosted Pages:
Authors:
Haitham Husseini Ali Mohamed Fathy
Journal: J Mater Sci: Mater Electron USA Volume:
Keywords : Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu    
Abstract:
Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for lip chip technology
    
     
 
       

Author Related Publications

  • Haitham Husseini Ali Mohamed Fathy, "The influence of the crystallization temperature on the reliability of PbTiO3 thin films prepared by chemical solution deposition", Journal of the European Ceramic Society 37 (2017) 1449–145, 2016 More
  • Haitham Husseini Ali Mohamed Fathy, "The role of PbTiO3 layers in piezoelectric multilayer composite films based on Pb(Mg1/3Nb2/3)O3-PbTiO3", Thin Solid Films 636 (2017) 730–736, 2017 More
  • Haitham Husseini Ali Mohamed Fathy, "Microstructure and optical properties of Ni2+ doped PVA for optoelectronic devices", Elsevier, 2019 More
  • Haitham Husseini Ali Mohamed Fathy, "Microstructural modifications and properties of low-Ag-content SneAgeCu solder joints induced by Zn alloying", Elsevier, 2015 More
  • Haitham Husseini Ali Mohamed Fathy, "Nonlinear behavior of the current–voltage characteristics for erbiumdoped PVA polymeric composite films", Springer, 2019 More

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