Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for lip chip technology

Faculty Science Year: 2017
Type of Publication: ZU Hosted Pages:
Authors:
Journal: J Mater Sci: Mater Electron USA Volume:
Keywords : Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu    
Abstract:
Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for lip chip technology
   
     
 
       

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