Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn

Faculty Science Year: 2014
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Elsaid Hassan Hammad
Journal: Materials and Design elsevier Volume:
Keywords : Properties enhancement , , Ag-content Sn–Ag–Cu lead-free solders containing    
Abstract:
This study examines the effect of Zn addition on the microstructure, melt properties and tensile behavior of low Ag-content Sn–1.0Ag–0.3Cu (SAC103) lead-free solder. The results show that addition of 2.0 wt.% Zn to SAC(103) solder resulte
    
     
 
       

Author Related Publications

  • Ahmed Elsaid Hassan Hammad, "Nano-Lead free solder alloys for electronic packaging and integration", Pushpa Publishing House, 2016 More
  • Ahmed Elsaid Hassan Hammad, "Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni", Elsevier, 2013 More
  • Ahmed Elsaid Hassan Hammad, "Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications", Elsevier, 2013 More
  • Ahmed Elsaid Hassan Hammad, "Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions", elsevier, 2012 More
  • Ahmed Elsaid Hassan Hammad, "Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05", springer, 2014 More

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