Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05

Faculty Science Year: 2014
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Elsaid Hassan Hammad
Journal: Journal of ELECTRONIC MATERIALS springer Volume:
Keywords : Mechanical Deformation Behavior , Sn-Ag-Cu Solders with Minor    
Abstract:
The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni e
    
     
 
       

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