Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

Faculty Science Year: 2012
Type of Publication: ZU Hosted Pages:
Authors:
Journal: Materials and Design elsevier Volume:
Keywords : Enhancement , creep resistance , thermal behavior , eutectic    
Abstract:
The eutectic Sn–0.7Cu solder alloy is widely used in electronic packaging in which the creep property of the solder joint is essential to meet the global demand for longer operating lifetime in their applications. In this study, the influ
   
     
 
       

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