Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In

Faculty Science Year: 2011
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Elsaid Hassan Hammad
Journal: Journal of Alloys and Compounds elsevier Volume:
Keywords : Development , high strength Sn–0.7Cu solders with    
Abstract:
Nowadays, a major concern of Sn–Cu based solder alloys is focused on continuously improving the comprehensive properties of solder joints formed between the solders and substrates. In this study, the influence of Ag and/or In doping on th
    
     
 
       

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  • Ahmed Elsaid Hassan Hammad, "Nano-Lead free solder alloys for electronic packaging and integration", Pushpa Publishing House, 2016 More
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  • Ahmed Elsaid Hassan Hammad, "Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications", Elsevier, 2013 More
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  • Ahmed Elsaid Hassan Hammad, "Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05", springer, 2014 More

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