Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In

Faculty Science Year: 2011
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Elsaid Hassan Hammad
Journal: Journal of Alloys and Compounds elsevier Volume:
Keywords : Structural , elastic properties , eutectic Sn–Cu lead-free    
Abstract:
Sn–Cu alloys have been considered as a candidate for high temperature lead-free microelectronic solders. In the present study, the change in microstructure, attenuation and elastic behavior associated with alloying of Ag and/or In into th
    
     
 
       

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