Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy

Faculty Science Year: 2014
Type of Publication: ZU Hosted Pages:
Authors:
Azza Azab Ibrahim Ibrahim
Journal: Materials and Design Materials and Design Volume:
Keywords : Design , lead-free candidate alloys , low-temperature soldering applications    
Abstract:
The coupling effect of both minor alloying addition and reducing the amount of Zn phase have been proposed as an important strategy to improve the integrity and reliability of eutectic Sn–9Zn solder joints. In this work, the changes in mi
    
     
 
       

Author Related Publications

  • Azza Azab Ibrahim Ibrahim, "Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions", Materials and Design, 2013 More
  • Azza Azab Ibrahim Ibrahim, "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications", springer, 2101 More
  • Azza Azab Ibrahim Ibrahim, "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications", USA, 2017 More
  • Azza Azab Ibrahim Ibrahim, "Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles", Elsevier, 2017 More
  • Azza Azab Ibrahim Ibrahim, "The role of delayed elasticity and stress relaxation in Sn-Bi-Cu leadfree solders solidified under permanent magnet stirring", Journal of Alloys and Compounds, 2017 More

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