Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Azza Azab Ibrahim Ibrahim
Journal: Materials and Design Materials and Design Volume:
Keywords : Enhancing mechanical response , hypoeutectic Sn–6.5Zn solder    
Abstract:
In this paper, we report a convenient and informative procedure for improving the integrity and reliability of eutectic Sn–9Zn solder using minor alloying additions of Ni and Sb after reducing the amount of Zn phase. Results indicate that
    
     
 
       

Author Related Publications

  • Azza Azab Ibrahim Ibrahim, "Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy", Materials and Design, 2014 More
  • Azza Azab Ibrahim Ibrahim, "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications", springer, 2101 More
  • Azza Azab Ibrahim Ibrahim, "Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications", USA, 2017 More
  • Azza Azab Ibrahim Ibrahim, "Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles", Elsevier, 2017 More
  • Azza Azab Ibrahim Ibrahim, "The role of delayed elasticity and stress relaxation in Sn-Bi-Cu leadfree solders solidified under permanent magnet stirring", Journal of Alloys and Compounds, 2017 More

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