Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Abdulrahman Abdullah Awadallah
Journal: Materials Science & Engineering A Elsevier Volume:
Keywords : Novel , nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good    
Abstract:
In this study, the SiC nanoparticles were successfully fabricated by high energy ball milling. Mechanical mixing technique has been used to disperse nanometric SiC in Sn–1.0Ag–0.5Cu (SAC105) solder at 450 1C for 2 h. In comparison with SA
    
     
 
       

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  • Abdulrahman Abdullah Awadallah, "Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions", Elsevier, 2013 More
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  • Abdulrahman Abdullah Awadallah, "Fabrication ofsiliconcarbidereinforcedaluminummatrixnanocomposites and characterizationofitsmechanicalpropertiesusing non-destructivetechnique", Elsevier, 2012 More

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