Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Journal: Materials Science & Engineering A Elsevier Volume:
Keywords : Novel , nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good    
Abstract:
In this study, the SiC nanoparticles were successfully fabricated by high energy ball milling. Mechanical mixing technique has been used to disperse nanometric SiC in Sn–1.0Ag–0.5Cu (SAC105) solder at 450 1C for 2 h. In comparison with SA
   
     
 
       

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