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The dynamic and static mechanical characteristics of Sn-7Zn-based solder alloy modified with microalloying of In, Fe and Co elements
Faculty
Science
Year:
2022
Type of Publication:
ZU Hosted
Pages:
26728–26743
Authors:
Ahmed Mohamed Eltaher Abdulaal
Staff Zu Site
Abstract In Staff Site
Journal:
Journal of Materials Science: Materials in Electronics Springer
Volume:
Keywords :
, dynamic , static mechanical characteristics of Sn-7Zn-based solder
Abstract:
Tensile creep experiments and pulse-echo overlap (PEO) method were utilized to analyze the impact of small additions of 2.5%wt In, Fe and Co (0.1%wt for each) on the creep resistance and elastic properties of a cast Sn-7Zn alloy. The Inmodified alloy displays noticeably enhanced creep resistance and increased the fracture time (* 2.7 times) due to precipitation strengthening and formation of c-InSn4 particles. The In-modified alloy exhibits an as-solidified grain structure, which is finer than the Sn-7Zn alloy, and predicted to enhance deformation resistance by lattice self-diffusion creep. Nonetheless, the creep resistance of Sn7Zn alloy deteriorates after Fe and Co addition, highlighting the excellent coarsening of the new c-Zn21Co5, c-Co2Sn2Zn, and a-Fe0.92Sn0.08 precipitates. The obtained results implied that the creep strain rate follows the Garofalo hyperbolic sine equation, and the computed creep stress exponent is consistent with a climb-controlled dislocation creep. Consequently, for all PEO tests, the values of resulting Young’s modulus (E) (66.7 GPa) and shear modulus (G) (20.5 GPa) of In-modified Sn-7Zn alloy were superior to those of the conventional plain Sn-7Zn alloy and Fe and Co modified alloy in its cast condition.
Author Related Publications
Ahmed Mohamed Eltaher Abdulaal, "Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products", Materials and Design, 2014
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Ahmed Mohamed Eltaher Abdulaal, "Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly", Journal of Alloys and Compounds, 2014
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Ahmed Mohamed Eltaher Abdulaal, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Materials and Design, 2013
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Ahmed Mohamed Eltaher Abdulaal, "Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders", Materials and Design, 2013
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Ahmed Mohamed Eltaher Abdulaal, "Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders", Materials and Design, 2013
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Sara Hassan Ahmed Mulla, "Integration of a Thin Film PDMS-Based Capacitive Sensor for Tactile Sensing in an Electronic Skin", Hindawi Publishing Corporation, 2016
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Ahmed Mohamed Eltaher Abdulaal, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Materials and Design, 2013
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