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Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications
Faculty
Science
Year:
2021
Type of Publication:
ZU Hosted
Pages:
Page 85-96
Authors:
Mahmoud Suleiman Mohammed Dawood
Staff Zu Site
Abstract In Staff Site
Journal:
arab journal of nuclear sciences and applications arab journal of nuclear sciences and applications
Volume:
54
Keywords :
Viscoplastic Creep Characterization , Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free
Abstract:
In this study, the effects of adding 0.1-0.2wt.%Al on microstructure and creep properties of Sn–0.7Cu-0.2Ni (SCN) alloys were investigated. The presence of Ni in SCN alloy inhibits the polymorphic transition of Cu6Sn5 IMC particles and forms a more stable (Cu,Ni)6Sn5 IMC particles. After Al-microalloying, the Sn–0.7Cu-0.2Ni–xAl alloys exhibit heterogeneous-structure with an additional fine Al3Ni2 and Al2Cu IMC phases and coarse (Cu,Ni)6Sn5 IMCs. Adding of 0.1%Al to SCN solder is the most effective in softening while the creep rate and yield strength is slightly maintained down to the SCN solder level. Hence, the desirable creep property was attained in SCN-0.1 wt.%Al solder could play a significant role in drop impact performance enrichment in electronic devices. The creep deformation at stresses of 8.8–23.4 MPa is characterized by a stress exponents of 4.4-5.0 and activation energy of 46.8-53.9 kJ.mol-1 close to that for pipe-diffusion of Sn, which are typical of dislocation creep mechanism
Author Related Publications
Mahmoud Suleiman Mohammed Dawood, "Effect of ambient gas pressure and nature on the temporal evolution of aluminum laser-induced plasmas", American institute of physics, 2014
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Mahmoud Suleiman Mohammed Dawood, "Generation of Nanosized Particles during Mechanical Alloying and Their Evolution through the Hot Extrusion Process in Bismuth-Telluride-Based Alloys", Springer US, 2010
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