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Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn–Ag–Cu–Sb–Al solder alloy by ultrasonic pulse echo method
Faculty
Science
Year:
2020
Type of Publication:
ZU Hosted
Pages:
Authors:
Ahmed Mohamed Eltaher Abdulaal
Staff Zu Site
Abstract In Staff Site
Journal:
Journal of Materials Science: Materials in Electronics Springer
Volume:
Keywords :
Influence , permanent magnet stirring , dendrite morphological
Abstract:
Preventing columnar β-Sn grains forming during manufacture have undoubtedly become major challenges. Columnar grains are commonly considered as unfavorable as their existence can relocate defects of solidification and deterioration in mechanical properties; however, the practical application of permanent magnetic stirring (PMS) during manufacture assuredly makes columnar grains easy to avert. In this published work, we studied the influence of PMS application on the solidification microstructures (growth morphology), elastic properties using pulse echo overlap (PEO) method, electrical resistivity and tensile properties of SAC(0505)–Sb–Al solder alloy. The direct result shows that the equiaxed β-Sn grains produced with applying PMS instead of higher aspect ratio columnar β-Sn grains was expected due to the induced Lorentz force. Hence, both the elastic modulus and hardness are typically decreased as the ratio of Poisson increased with applying PMS. In addition, the Pugh ratio has elucidated the ductility behavioral of the alloy sample. The tensile testing results exhibited possible enhancement in ductility by PMS, which could tremendously increase the elastic compliance of bulk solders. The electrical resistivity displays increase in the ionic contribution with PMS. These remarkable results offer innovative methods for predicting the final microstructure to properly control dendritic growth in metallic alloys.
Author Related Publications
Ahmed Mohamed Eltaher Abdulaal, "Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products", Materials and Design, 2014
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Ahmed Mohamed Eltaher Abdulaal, "Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly", Journal of Alloys and Compounds, 2014
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Ahmed Mohamed Eltaher Abdulaal, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Materials and Design, 2013
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Ahmed Mohamed Eltaher Abdulaal, "Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders", Materials and Design, 2013
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Ahmed Mohamed Eltaher Abdulaal, "Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders", Materials and Design, 2013
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Department Related Publications
Abdullah Fathi Aly Saad, "Ageing effects on polymeric track detectors: studies of etched tracks at nanosize scale using atomic force microscope", RADIATION PHYSICS, 2012
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Ahmed Elfalaky Elsaid Abdelrehim, "Electrical and Dielectric Properties of Charge Transfer Complexes: Interactions between Norfloxacin and Ciprofloxacin with Picric Acid and 3,5-Dinitrobenzoic Acid1", Russa, 2013
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Ahmed Elfalaky Elsaid Abdelrehim, "Spectroscopic and physical measurements on charge-transfer complexes: Interactions between norfloxacin and ciprofloxacin drugs with picric acid and 3,5-dinitrobenzoic acid acceptors", Englabd, 2011
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Ahmed Elfalaky Elsaid Abdelrehim, "Bone-like Material, Synthesis, Optimization and Characterization", America, 2014
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Ahmed Elfalaky Elsaid Abdelrehim, "Structural and electrical properties of HgTe thin films", england, 2000
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