Viscoplastic characterization and mechanical strength of novel Sn–1.7Ag–0.7Cu lead‑free solder alloys with microalloying of Te and Co

Faculty Science Year: 2019
Type of Publication: ZU Hosted Pages:
Authors:
Mohammed Ahmed Abdu Abdullah
Journal: Journal of Materials Science: Materials in Electronics Springer Volume:
Keywords : Viscoplastic characterization and mechanical strength of novel Sn–1.7Ag–0.7Cu lead‑free    
Abstract:
Aipersistentidreamiinilead-freeiSn–Ag–Cuisoldericommunityiisitoiattainibothihighistrengthiandiductilityiforitheidesigniandi reliabilityiofisolderedijoints.iMicroalloyingiTeioriCoihasibeenianticipateditoimodifyitheilowiAg-contentiSn–1.7Ag–0.7Cui soldersiinidiferentiaspects.iThisiresearchiinvestigatesitheiefectiofiminoriadditionsiofiTeiandiCoionitheidevelopmentiofi solidi edimicrostructure,ithermalianditensileipropertiesiofiSn–1.7Ag–0.7Cuisoldersialloys.iItiisiseenithatitraceiamountiofi Teiadditioni(0.2βwt%)iresultsiinitheiformationiofiSnTeiintermetallici(IMC)iandiincreasingieutecticimicrostructure,iwhereasi aiminoriamountiofiCoi(0.5βwt%)iisicompletelyichangeditheisolidi cationimode.iMicroalloyingiCoire nesitheiiCu iandi iAg 3 Sniparticlesiandileadsitoiformationiofimoreistripe-likei(Cu,iCo) 6 Sn 5 imorphologyitogetheriwithiiCo Sn.iTheseiefectsi wereisigni cantlyienhancedibothitheihighistrengthibyi~i16%iandiductilityibyi~i72%iati110β°C,irespectively,iwhichiplayiai vitaliroleiinidropiimpactiimplementationidevelopment.iMoreover,iTeioriCo-microalloyingicouldiseverelyimodifyitheigrowthi restrictionifactoriofiSAC177isolderiandimarkedlyireduceitheidegreeiofiundercoolingiofiSAC177ifromi17.8itoi11.6iandi2.6β°C,i respectively.iTheiutilityiofithisiresearchiwasidemonstratedibyidesigniofilead-freeimicro-jointsithatisimultaneouslyiexhibiti high-reliabilityiwithilowicost. 3 6 Sn 5
    
     
 
       

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