Microstructural modifications and properties of low-Ag-content SneAgeCu solder joints induced by Zn alloying

Faculty Science Year: 2015
Type of Publication: ZU Hosted Pages:
Authors:
Haitham Husseini Ali Mohamed Fathy
Journal: Optik Elsevier Volume:
Keywords : Microstructural modifications , properties , low-Ag-content SneAgeCu solder joints    
Abstract:
The effects of Zn addition on microstructure development and tensile properties of Sne2.0Age0.7Cu (SAC207) lead-free solders were investigated. Microstructural analysis reveal that 1.5 wt.% Zn addition not only refined the Ag3Sn and Cu6Sn
    
     
 
       

Author Related Publications

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  • Haitham Husseini Ali Mohamed Fathy, "Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for lip chip technology", USA, 2017 More
  • Haitham Husseini Ali Mohamed Fathy, "The role of PbTiO3 layers in piezoelectric multilayer composite films based on Pb(Mg1/3Nb2/3)O3-PbTiO3", Thin Solid Films 636 (2017) 730–736, 2017 More
  • Haitham Husseini Ali Mohamed Fathy, "Microstructure and optical properties of Ni2+ doped PVA for optoelectronic devices", Elsevier, 2019 More
  • Haitham Husseini Ali Mohamed Fathy, "Nonlinear behavior of the current–voltage characteristics for erbiumdoped PVA polymeric composite films", Springer, 2019 More

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