The effect of undercooling on the microstructure and tensile properties of hypoeutectic Sn-6.5Zn-xCu Pb-free solders

Faculty Science Year: 2015
Type of Publication: ZU Hosted Pages:
Authors:
Hassan AbdulHameed Mohamed Hasheim
Journal: Mater. Des Elsever Volume:
Keywords : , effect , undercooling , , microstructure , tensile properties , hypoeutectic    
Abstract:
Hypoeutectic Sn–6.5Zn alloy may be regarded as a better choice than eutectic Sn–9Zn lead-free solder in microelectronics industry. In this study, the properties of hypoeutectic Sn–6.5Zn lead-free solder were modified with minor additions of
    
     
 
       

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