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Microstructure, electrical, mechanical and thermal properties of melt-spun bismuth-tin eutectic alloy
Faculty
Science
Year:
2006
Type of Publication:
Article
Pages:
143-148
Authors:
Mazen, S, Kamal, M, El-Bediwi, AB, Kashita, E
DOI:
10.1080/10420150500493709
Journal:
RADIATION EFFECTS AND DEFECTS IN SOLIDS TAYLOR \& FRANCIS LTD
Volume:
161
Research Area:
Nuclear Science \& Technology; Physics
ISSN
ISI:000236739900008
Keywords :
electrical resistivity, mechanical and thermal properties, lead-free solder
Abstract:
Microstructure, electrical, mechanical and thermal properties of melt-spun Bi58Sn42 eutectic alloy have been investigated using scanning electron microscopy, X-ray analysis, the double bridge method, dynamic resonance method, Vickers hardness measurement and thermal analysis. The structure and physical properties of this alloy are affected by the preparation method (rapid solidification technique). The bismuth-tin eutectic alloy has good properties as a lead-free solder alloy, such as low melting point and adequate cost and mechanical properties when compared with commercial tin-lead solder alloys.
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