Novel symbol-like IMC formation and changes in the electrical, thermal and mechanical properties of Bi doped Sn–2.0Ag–0.7Cu solders

Faculty Science Year: 2017
Type of Publication: ZU Hosted Pages:
Authors:
Journal: Arab Journal of Nuclear Sciences and Applications, Arab Journal of Nuclear Sciences and Applications, Volume:
Keywords : Novel symbol-like , formation , changes , , electrical, thermal    
Abstract:
In this paper, effects of Bi element on microstructure, thermal behavior, electrical resistivity and mechanical properties of Sn–2Ag-0.7Cu (SAC207) based lead-free solder were investigated. We show that the addition of 0.8wt.%Bi element dra
   
     
 
       

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