Novel symbol-like IMC formation and changes in the electrical, thermal and mechanical properties of Bi doped Sn–2.0Ag–0.7Cu solders

Faculty Science Year: 2017
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Mohamed Eltaher Abdulaal
Journal: Arab Journal of Nuclear Sciences and Applications, Arab Journal of Nuclear Sciences and Applications, Volume:
Keywords : Novel symbol-like , formation , changes , , electrical, thermal    
Abstract:
In this paper, effects of Bi element on microstructure, thermal behavior, electrical resistivity and mechanical properties of Sn–2Ag-0.7Cu (SAC207) based lead-free solder were investigated. We show that the addition of 0.8wt.%Bi element dra
    
     
 
       

Author Related Publications

  • Ahmed Mohamed Eltaher Abdulaal, "Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products", Materials and Design, 2014 More
  • Ahmed Mohamed Eltaher Abdulaal, "Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly", Journal of Alloys and Compounds, 2014 More
  • Ahmed Mohamed Eltaher Abdulaal, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More

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  • Abdulrahman Abdullah Awadallah, "Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions", Elsevier, 2013 More
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