Novel symbol-like IMC formation and changes in the electrical, thermal and mechanical properties of Bi doped Sn–2.0Ag–0.7Cu solders

Faculty Science Year: 2017
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Mohamed Eltaher Abdulaal
Journal: Arab Journal of Nuclear Sciences and Applications, Arab Journal of Nuclear Sciences and Applications, Volume:
Keywords : Novel symbol-like , formation , changes , , electrical, thermal    
Abstract:
In this paper, effects of Bi element on microstructure, thermal behavior, electrical resistivity and mechanical properties of Sn–2Ag-0.7Cu (SAC207) based lead-free solder were investigated. We show that the addition of 0.8wt.%Bi element dra
    
     
 
       

Author Related Publications

  • Ahmed Mohamed Eltaher Abdulaal, "Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products", Materials and Design, 2014 More
  • Ahmed Mohamed Eltaher Abdulaal, "Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly", Journal of Alloys and Compounds, 2014 More
  • Ahmed Mohamed Eltaher Abdulaal, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Materials and Design, 2013 More
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  • Ahmed Mohamed Eltaher Abdulaal, "Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More

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  • Ahmed Mohamed Eltaher Abdulaal, "Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead‑Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi", Springer, 2020 More
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