Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

Faculty Science Year: 2014
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Mohamed Eltaher Abdulaal
Journal: Journal of Alloys and Compounds Journal of Alloys and Compounds Volume:
Keywords : Development , , multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost    
Abstract:
Eutectic Sn–Ag–Cu (SAC) solder is one of the candidate alternatives to Sn–Pb-based solder alloys. The coupling effect of both minor alloying Bi addition and reducing the amount of Ag phase have been proposed as an important approach to op
    
     
 
       

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  • Ahmed Mohamed Eltaher Abdulaal, "Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More
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  • Ahmed Mohamed Eltaher Abdulaal, "Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder", Journal of Alloys and Compounds, 2013 More

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