Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products

Faculty Science Year: 2014
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Mohamed Eltaher Abdulaal
Journal: Materials and Design Materials and Design Volume:
Keywords : Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy    
Abstract:
In this study, the low Ag-content Sn–1.5Ag–0.7Cu (SAC157) lead-free solder was modified for advance electronic components with minor additions of Bi. The microstructure, melt properties and tensile behavior after and before compositional
   
     
 
       

Author Related Publications

  • Ahmed Mohamed Eltaher Abdulaal, "Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly", Journal of Alloys and Compounds, 2014 More
  • Ahmed Mohamed Eltaher Abdulaal, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder", Journal of Alloys and Compounds, 2013 More

Department Related Publications

  • Ahmed Mohamed Eltaher Abdulaal, "Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead‑Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi", Springer, 2020 More
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