Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products

Faculty Science Year: 2014
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Mohamed Eltaher Abdulaal
Journal: Materials and Design Materials and Design Volume:
Keywords : Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy    
Abstract:
In this study, the low Ag-content Sn–1.5Ag–0.7Cu (SAC157) lead-free solder was modified for advance electronic components with minor additions of Bi. The microstructure, melt properties and tensile behavior after and before compositional
   
     
 
       

Author Related Publications

  • Ahmed Mohamed Eltaher Abdulaal, "Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly", Journal of Alloys and Compounds, 2014 More
  • Ahmed Mohamed Eltaher Abdulaal, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder", Journal of Alloys and Compounds, 2013 More

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  • Abdulrahman Abdullah Awadallah, "Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions", Elsevier, 2012 More
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