Improved creep resistance and thermal behavior of Ni-doped
Sn–3.0Ag–0.5Cu lead-free solder

Faculty	Science	Year:	2013
Type of Publication:	ZU Hosted	Pages:
Authors:	Ahmed Mohamed Eltaher Abdulaal Staff Zu Site Abstract In Staff Site
Journal:	Journal of Alloys and Compounds Journal of Alloys and Compounds	Volume:

Keywords :	Improved creep resistance , thermal behavior , Ni-doped Sn–3.0Ag–0.5Cu
Abstract:	To develop lead-free solders for advance electrical components, a series of Sn–3.0Ag–0.5Cu (SAC 305) solders containing small amounts of Ni have been investigated. Results showed that the addition of Ni not only decreased the amount of un

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