Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Mohamed Eltaher Abdulaal
Journal: Journal of Alloys and Compounds Journal of Alloys and Compounds Volume:
Keywords : Improved creep resistance , thermal behavior , Ni-doped Sn–3.0Ag–0.5Cu    
Abstract:
To develop lead-free solders for advance electrical components, a series of Sn–3.0Ag–0.5Cu (SAC 305) solders containing small amounts of Ni have been investigated. Results showed that the addition of Ni not only decreased the amount of un
    
     
 
       

Author Related Publications

  • Ahmed Mohamed Eltaher Abdulaal, "Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products", Materials and Design, 2014 More
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  • Ahmed Mohamed Eltaher Abdulaal, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More

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