Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Mohamed Eltaher Abdulaal
Journal: Journal of Alloys and Compounds Journal of Alloys and Compounds Volume:
Keywords : Improved creep resistance , thermal behavior , Ni-doped Sn–3.0Ag–0.5Cu    
Abstract:
To develop lead-free solders for advance electrical components, a series of Sn–3.0Ag–0.5Cu (SAC 305) solders containing small amounts of Ni have been investigated. Results showed that the addition of Ni not only decreased the amount of un
    
     
 
       

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