Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Mohamed Eltaher Abdulaal
Journal: Materials and Design Materials and Design Volume:
Keywords : Enhanced ductility , mechanical strength , Ni-doped Sn–3.0Ag–0.5Cu lead-free    
Abstract:
In this paper, the tensile tests were conducted to investigate the effect of adding a small amount of Ni on the microstructure, thermal and mechanical properties of 3.0Ag–0.5Cu(SAC 305) solder. The results indicated that addition of Ni ca
    
     
 
       

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  • Ahmed Mohamed Eltaher Abdulaal, "Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products", Materials and Design, 2014 More
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  • Ahmed Mohamed Eltaher Abdulaal, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Materials and Design, 2013 More
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  • Ahmed Mohamed Eltaher Abdulaal, "Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder", Journal of Alloys and Compounds, 2013 More

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