Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Mohamed Eltaher Abdulaal
Journal: Materials and Design Materials and Design Volume:
Keywords : Evolution , thermal property , creep resistance , , , Zn-doped Sn–2.0Ag–0.5Cu    
Abstract:
The effect of small amount of Ni and Zn additions on thermal behavior and creep properties of Sn–2Ag– 0.5Cu (SAC 205) lead free solder alloy was investigated. Additions of Ni and Zn, respectively, into SAC (205) solder caused its undercoo
    
     
 
       

Author Related Publications

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  • Ahmed Mohamed Eltaher Abdulaal, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Materials and Design, 2013 More
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  • Ahmed Mohamed Eltaher Abdulaal, "Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder", Journal of Alloys and Compounds, 2013 More

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