Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters

Faculty Science Year: 2013
Type of Publication: ZU Hosted Pages:
Authors:
Ahmed Mohamed Eltaher Abdulaal
Journal: Materials and Design Materials and Design Volume:
Keywords : Improved strength , , , Zn-doped Sn–2.0Ag–0.5Cu lead-free solder    
Abstract:
The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder for flip-chip interconnects. The changes in microstructure, microhardness and mechanical properties
   
     
 
       

Author Related Publications

  • Ahmed Mohamed Eltaher Abdulaal, "Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products", Materials and Design, 2014 More
  • Ahmed Mohamed Eltaher Abdulaal, "Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly", Journal of Alloys and Compounds, 2014 More
  • Ahmed Mohamed Eltaher Abdulaal, "Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders", Materials and Design, 2013 More
  • Ahmed Mohamed Eltaher Abdulaal, "Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder", Journal of Alloys and Compounds, 2013 More

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