Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications

Faculty Science Year: 2101
Type of Publication: ZU Hosted Pages:
Authors:
Abdulrahman Abdullah Awadallah
Journal: Journal of Materials Science: Materials in Electronics springer Volume:
Keywords : Change aspects , microstructure , mechanical behavior , Bi and    
Abstract:
Sn–Cu alloys were recommended as a promising substitute for traditional Sn–Pb alloy in wave soldering applications. In the present study, the change of microstructure, thermal and mechanical behavior associated with alloying of Bi and Z
    
     
 
       

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  • Abdulrahman Abdullah Awadallah, "Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders", ُElsevier, 2013 More
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  • Abdulrahman Abdullah Awadallah, "Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters", Elsevier, 2013 More
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  • Abdulrahman Abdullah Awadallah, "Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles", springer, 2013 More

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