Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn-3.0Ag-0.5Cu lead-free solder. Mater. Sci. Eng. A 17, 389-3973

Faculty Science Year: 2014
Type of Publication: ZU Hosted Pages:
Authors:
Tariq Ahmed Mahmoud Musalmi
Journal: Materials Science and Engineering Elsevier Volume:
Keywords : Tensile deformation behavior , melting property , nano-sized    
Abstract:
In the present study, nano-sized ZnO particle-reinforced Sn–3.0Ag–0.5Cu (SAC305) composite solder was prepared by mechanically dispersing nano-particles into SAC305 solder at 900 1C for 2 h. The effects of ZnO addition on microstructure, me
    
     
 
       

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