Microstructural modifications and properties of low-Ag-content Sn-Ag-Cu solder joints induced by Zn alloying

Faculty Science Year: 2015
Type of Publication: ZU Hosted Pages:
Authors:
Tariq Ahmed Mahmoud Musalmi
Journal: Journal of Alloys and Compounds Elsevier Volume:
Keywords : Microstructural modifications , properties , low-Ag-content Sn-Ag-Cu solder    
Abstract:
The effects of Zn addition on microstructure development and tensile properties of Sn-2.0Ag-0.7Cu (SAC207) lead-free solders were investigated. Microstructural analysis reveal that 1.5 wt.% Zn addition not only refined the Ag3Sn and Cu6Sn5
   
     
 
       

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