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Microstructural modifications and properties of low-Ag-content Sn-Ag-Cu solder joints induced by Zn alloying
Faculty
Science
Year:
2015
Type of Publication:
ZU Hosted
Pages:
Authors:
Tariq Ahmed Mahmoud Musalmi
Staff Zu Site
Abstract In Staff Site
Journal:
Journal of Alloys and Compounds Elsevier
Volume:
Keywords :
Microstructural modifications , properties , low-Ag-content Sn-Ag-Cu solder
Abstract:
The effects of Zn addition on microstructure development and tensile properties of Sn-2.0Ag-0.7Cu (SAC207) lead-free solders were investigated. Microstructural analysis reveal that 1.5 wt.% Zn addition not only refined the Ag3Sn and Cu6Sn5
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Department Related Publications
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