In°uences of Ag and Au Additions on Structure and Tensile Strength of Sn-5Sb Lead Free Solder Alloy

Faculty Science Year: 2008
Type of Publication: ZU Hosted Pages:
Authors:
Yehia Ibrahim Aly Sweilem
Journal: Journal of Materials Science & Technology Elsevier B.V. Volume:
Keywords : In°uences , , , , Additions , Structure and Tensile Strength , Sn-5Sb    
Abstract:
It is important, for electronic application, to decrease the melting point of Sn-5Sb solder alloy because it is relatively high as compared with the most popular eutectic Pb-Sn solder alloy. Adding Au or Ag can decrease the onset melting
   
     
 
       

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