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Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and In
Faculty
Science
Year:
2011
Type of Publication:
Article
Pages:
8554-8560
Authors:
Hammad, A. E, El-Daly, A. A
DOI:
10.1016/j.jallcom.2011.05.119
Journal:
JOURNAL OF ALLOYS AND COMPOUNDS ELSEVIER SCIENCE SA
Volume:
509
Research Area:
Chemistry; Materials Science; Metallurgy \& Metallurgical Engineering
ISSN
ISI:000292914000013
Keywords :
Lead-free solder, Sn-Cu alloy, Microstructure, Intermetallic compounds, Tensile properties
Abstract:
Nowadays, a major concern of Sn-Cu based solder alloys is focused on continuously improving the comprehensive properties of solder joints formed between the solders and substrates. In this study, the influence of Ag and/or In doping on the microstructures and tensile properties of eutectic Sn-0.7Cu lead free solder alloy have been investigated. Also, the effects of temperature and strain rate on the mechanical performance of Sn-0.7Cu, Sn-0.7Cu-2Ag, Sn-0.7Cu-2In and Sn-0.7Cu-2Ag-2In solders were investigated. The tensile tests showed that while the ultimate tensile strength (UTS) and yield stress (YS) increased with increasing strain rate, they decreased with increasing temperature, showing strong strain rate and temperature dependence. The results also revealed that with the addition of Ag and In into Sn-0.7Cu, significant improvement in YS (similar to 255\%) and UTS (similar to 215\%) is realized when compared with the other commercially available Sn-0.7 wt. \% Cu solder alloys. Furthermore, the Sn-0.7Cu-2Ag-2In solder material developed here also exhibits higher ductility and well-behaved mechanical performance than that of eutectic Sn-0.7Cu commercial solder. Microstructural analysis revealed that the origin of change in mechanical properties is attributed to smaller beta-Sn dendrite grain dimensions and formation of new inter-metallic compounds (IMCs) in the ternary and quaternary alloys. (C) 2011 Elsevier B.V. All rights reserved.
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