Effect of Organic Solvents on the Electrodeposition of Copper from Acidified CuSO4

Metals are deposited in a very rough or powdery form when the electrolysis is carried out at the limiting current. This seems to be a general rule in the case of copper. The possibility of preventing powder formation at the limiting current by means of a suitable additive is of great interest in electroplating and in electrometallurgy in general. Some organic substances are used as additives in electroplating, electrowinning, and electroforming in order to improve the quality of the electrodeposits, since they produce fine-grained smooth bright deposits. The electrodeposition of copper in cells using copper anodes was studied in the presence of organic solvents as pyridine, DMF, DMSO, ACN, dioxane, formamide, MCS, and BCS. It has been found that the rate of electrodeposition is decreased by amount ranging from zero to 46.67\% when using copper anodes, depending on the concentration of organic solvents and time. Langmuir, kinetic, and Freundlich isotherms are applied. The rate of electrodeposition increases with the increasing rate of the rotation of the cylinder electrode. This proves that the electrodeposition process is diffusion controlled dimensionless groups are given. The data can be relation by the following equations at 25 degrees C: 1 For pyridine solutions Sh = 0.1105 Re-0.695 Sc-0.33 2 For dimethylformamide solution Sh = 0.1096 Re-0.696 Sc-0.33 3 For dimethylsulphoxide solutions Sh = 0.1087 Re-0.697 Sc-0.33 4 For formamide solutions Sh = 0.1077 Re-0.698 Sc-0.33 5 For acetonitrile solutions Sh = 0.1096 Re-0.696 Sc-0.33 6 For 1,4-dioxane solutions Sh = 0.1077 Re-0.698 Sc-0.33 7 For 2-methoxyethanol solutions Sh = 0.1106Re(0.695) Sc-0.33 8 For 2-butoxyethanol solutions Sh = 0.1107 Re-0.695 Sc-0.33