Model for Nano-Scale Bonding Wires under Thermal Loading

Faculty Engineering Year: 2014
Type of Publication: ZU Hosted Pages:
Authors:
Mohammed Abdelmoniem Mohamed Eltaher
Journal: Proceedings of the 14th IEEE International Conference on Nanotechnology IEEE Volume:
Keywords : Model , Nano-Scale Bonding Wires under Thermal    
Abstract:
In a companion paper, we studied the behavior of thick bonding wires under thermal loading and found good wire performance at elevated temperatures. This study extends the previous work to explore analyitcally the static stab
    
     
 
       

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