Effect of Ni and Sb Additions on the Thermal and Mechanical Properties of Sn-Ag-Cu(SAC105)Lead-Free Solder Alloy

Faculty	Science	Year:	2013
Type of Publication:	Theses	Pages:	135
Authors:	Doaa Abd Elhamed Mohameed AbdElazeez
		BibID	11762598
Keywords :	SnAgCu(SAC105) LeadFree Solder Alloy
Abstract:	Sn-Pb solder alloy for metal interconnections has a long history, dating back 2000 years. These alloys are the dominant solders used widely in manufacture because of their unique combination of material properties, such as low cost, availability, low melt

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