STRUCTURAL CHANGES AND PHYSICAL PROPERTIES OF Sn-Zn BASED AND Sn- Sb BASED SOLDER ALLOYS RAPIDLY SOLIDIFIED from MELT

Four groups of the lead-free alloys which rapidly solidified from melt were prepared. Each group contains five different alloys. These groups are: group I which was formed from Sn90Sb10-xBix, group II was formed from Sn90Sb10-xCux, group III which was forThe alloy hardness increased with increasing its content from bismuth (Bi). On the other hand the hardness increased with decreasing the alloy antimony (Sb) content. The maximum hardness recorded was 34.7 (107 Pa) for the alloys that have the maximum contThe thermal conductivity decreases with increasing the material content of both Bi and Cu. The highest thermal conductivity values were recorded for the binary alloys where, it was 5.83 W.m-1.K-1 for Sn90Sb10 alloy and 12.79 W.m-1.K-1 Sn90 Zn 10 alloy. ThThe electrical resistivity ranged from 26 - 30X10-8 ohm.m for Sn-Sb-Bi alloys (group I), from 24.2-26X10-8 ohm.m for the Sn-Sb-Cu alloys (group II), from 11.8-22.8X10-8 ohm.m for the Sn-Zn-Bi alloys (group III), and from 11.8-40.0X10-8 ohm.m for the Sn-Zn